From December 10 to 11, 2020, the two-day China IC design industry 2020 annual conference and Chongqing IC industry innovation and Development Summit Forum (ICCAD 2020) was held in Chongqing Yuelai International Conference Center. More than 3000 industry chain professionals from all over the country attended the event. Since its establishment in 1994, ICCAD has successfully held 26 sessions in Shenzhen, Hangzhou, Chengdu, Wuhan, Shanghai, Zhuhai, Dalian, Beijing, Xiamen, Wuxi, Xi'an, Hefei, Hong Kong, Tianjin, Changsha, Nanjing, Chongqing and other places, and has become one of the most influential industry events in China's semiconductor industry.

      At present, the integrated circuit industry with its important strategic position has gradually become the main battlefield of international competition and the core focus of global attention. In this new situation: on the one hand, the development of integrated circuit technology innovation has entered a new stage, and China's super large-scale market advantage and domestic demand potential will be transformed into the largest comparative advantage. It is expected that through the construction of domestic value chain based on domestic large-scale market, the "siphon effect" of gathering innovation elements will be produced, which will bring rare development opportunities for China's integrated circuit industry. On the other hand, the high-tech game between China and the United States has gradually become the focus of Sino US economic and trade frictions. The international environment continues to adjust in depth, and many changes in the development environment will have a potentially significant impact on the trend of the global IC supply chain system. As the leader of the industry and the main link of technology and product innovation, the IC design industry bears an important responsibility in the industrial development.

      Professor Wei Shaojun, chairman of integrated circuit design branch of China Semiconductor Industry Association, delivered a keynote report entitled "seize the opportunity and realize leap forward". While celebrating our achievements this year, we also warn the industry to keep a clear mind and strong fighting spirit, seize the opportunity and realize the leap forward. By constantly meeting customer needs and creating value for customers, we can enhance the value of our design enterprises.

      As one of the invited enterprises, Leadyo IC Testing (688135. SH) attended the most important annual conference of the IC design industry. Zhang Yifeng, general manager of Liyang chip, delivered a keynote speech on "opportunities for third-party professional chip testing in the new era". He said that chip testing has become an indispensable part of the IC industry chain. With the development of domestic chip design companies, chip testing has become more and more important With the advancement of the localization process, chip testing will exceed the output value of 10 billion US dollars, and the third-party professional chip testing will usher in a major development opportunity.

      During the meeting, Zhang Yifeng, general manager of the company, and three guests from the industry chain, including mentor, Hejian and Xinyuan, received collective interviews from more than ten professional media, including China Electronics News, semi semiconductor manufacturing, electronic products world, semiconductor industry observation, electronic innovation network, and non network, Xinbang, electronic enthusiasts and international e-commerce. The interviews were conducted by EDN Mr. Zhang Yubo, chief analyst of China.

      In this exhibition, Leadyo IC Testing shows 33 kinds of chip test solutions, showing the company's strong strength. The main business of Liyang chip includes wafer testing (CP) and chip finished product testing (FT), as well as one-stop services such as wafer thinning, wafer cutting, wafer picking and IC taping, pin scanning, high temperature aging, etc. It also provides integrated circuit test solution development, test software development, chip verification test analysis, load board production, MPW engineering batch verification, probe card production and other related supporting services.