FT: after wafer testing, wafer is packaged separately with epoxy resin or other materials by a series of packaging processes, such as cutting, bonding, wire bonding and plastic packaging, to form a separate IC, and then the electrical parameters of each IC are tested by ate, loadboard and handler, according to certain specifications The process of screening out good and bad ICs.

      Leadyo chip introduces advanced machine handler from the United States, Japan and Taiwan, which has strong testing ability and stable and reliable testing quality. Testable package types include sip, QFP, LQFP, QFN, PLCC, BGA, dip, SOP, SSOP, TSOP, tssop, μ BGA and CSP, etcNS-8080 / NS-8040/  CRH8516 / CRH8508 / MT9510 / 1028C / ASM...

      We provide different types of separators to meet the test requirements of different products.