In 2020, with 5g and new infrastructure becoming the core engine of information economy, the depressed global semiconductor market was expected to usher in recovery, but the increasingly complex international situation has brought new challenges to the development of global IC industry. Novel coronavirus pneumonia, Sino US trade war, HUAWEI incident... The whole industry is moving forward in turbulence and uncertainty.

      In this context, the fourth 2020 micro semiconductor summit with the theme of "exploring the new logic of the era of change" was successfully held in Haicang, Xiamen from August 27 to 28, aiming to explore the new business logic of the market under the changing market environment of the external world.

      In this unprecedented summit, representatives from more than 500 enterprises and 250 investment institutions were selected from thousands of semiconductor industry executives who signed up for the summit. Nearly 100000 people participated in this top industry summit feast through major online live broadcasting platforms.

      Zhang Yifeng, CEO of Liyang chip, was invited to attend the summit and delivered a keynote speech entitled "development opportunities of third party professional chip testing in the new era" at the 2020 annual meeting of the Alumni Association of Xidian microelectronics industry and the 5th alumni forum of Xidian microelectronics industry.

      At the same time, Liyang chip was added as an enterprise member at the 4th China Semiconductor investment alliance Council of the micro semiconductor summit. In the core era, core opportunities, core dreams, Liyang chip will, together with its industrial partners, adhere to the enterprise tenet of "integrity-based, sustainable management", continue to cultivate deeply in the field of chip testing, and spare no effort to escort China core!

Group photo of Xidian microelectronics Alumni Association

Note: part of the material in this paper comes from Jiwei